Research / MetaMobility Lab
Distributed Computing Physical Architecture
Compact electronics packaging for modular sensor, compute, and wiring hardware on wearable robotics systems.
Overview
Description draft
Project Notes
Longer description coming soon. This page is set up for a fuller writeup on packaging, wiring, serviceability, and distributed compute decisions.
- Packages embedded boards and wiring into compact printed housings.
- Keeps connectors accessible while protecting electronics during testing.
- Separates physical compute nodes so the wearable system can stay modular.
Images
